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| CVE-ID | ||
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CVE-2019-14030 |
• CVSS Severity Rating • Fix Information • Vulnerable Software Versions • SCAP Mappings • CPE Information
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| Description | ||
| The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130 | ||
| References | ||
| Note: References are provided for the convenience of the reader to help distinguish between vulnerabilities. The list is not intended to be complete. | ||
| Assigning CNA | ||
| Qualcomm, Inc. | ||
| Date Record Created | ||
| 20190719 | Disclaimer: The record creation date may reflect when the CVE ID was allocated or reserved, and does not necessarily indicate when this vulnerability was discovered, shared with the affected vendor, publicly disclosed, or updated in CVE. | |
| Phase (Legacy) | ||
| Assigned (20190719) | ||
| Votes (Legacy) | ||
| Comments (Legacy) | ||
| Proposed (Legacy) | ||
| N/A | ||
| This is a record on the CVE List, which provides common identifiers for publicly known cybersecurity vulnerabilities. | ||
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