CVE-ID

CVE-2016-2063

• CVSS Severity Rating • Fix Information • Vulnerable Software Versions • SCAP Mappings • CPE Information
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
References
Note: References are provided for the convenience of the reader to help distinguish between vulnerabilities. The list is not intended to be complete.
Assigning CNA
N/A
Date Entry Created
20160125 Disclaimer: The entry creation date may reflect when the CVE ID was allocated or reserved, and does not necessarily indicate when this vulnerability was discovered, shared with the affected vendor, publicly disclosed, or updated in CVE.
Phase (Legacy)
Assigned (20160125)
Votes (Legacy)
Comments (Legacy)
Proposed (Legacy)
N/A
This is an entry on the CVE List, which provides common identifiers for publicly known cybersecurity vulnerabilities.