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| CVE-ID | ||
|---|---|---|
CVE-2022-25677 |
• CVSS Severity Rating • Fix Information • Vulnerable Software Versions • SCAP Mappings • CPE Information
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| Description | ||
| Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | ||
| References | ||
| Note: References are provided for the convenience of the reader to help distinguish between vulnerabilities. The list is not intended to be complete. | ||
| Assigning CNA | ||
| Qualcomm, Inc. | ||
| Date Record Created | ||
| 20220222 | Disclaimer: The record creation date may reflect when the CVE ID was allocated or reserved, and does not necessarily indicate when this vulnerability was discovered, shared with the affected vendor, publicly disclosed, or updated in CVE. | |
| Phase (Legacy) | ||
| Assigned (20220222) | ||
| Votes (Legacy) | ||
| Comments (Legacy) | ||
| Proposed (Legacy) | ||
| N/A | ||
| This is an record on the CVE List, which provides common identifiers for publicly known cybersecurity vulnerabilities. | ||
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