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| CVE-ID | ||
|---|---|---|
CVE-2019-14093 |
• CVSS Severity Rating • Fix Information • Vulnerable Software Versions • SCAP Mappings • CPE Information
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| Description | ||
| Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20 | ||
| References | ||
| Note: References are provided for the convenience of the reader to help distinguish between vulnerabilities. The list is not intended to be complete. | ||
| Assigning CNA | ||
| Qualcomm, Inc. | ||
| Date Record Created | ||
| 20190719 | Disclaimer: The record creation date may reflect when the CVE ID was allocated or reserved, and does not necessarily indicate when this vulnerability was discovered, shared with the affected vendor, publicly disclosed, or updated in CVE. | |
| Phase (Legacy) | ||
| Assigned (20190719) | ||
| Votes (Legacy) | ||
| Comments (Legacy) | ||
| Proposed (Legacy) | ||
| N/A | ||
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