| CVE-ID | ||
|---|---|---|
CVE-2018-11277 |
• CVSS Severity Rating • Fix Information • Vulnerable Software Versions • SCAP Mappings • CPE Information
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| Description | ||
| In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue. | ||
| References | ||
| Note: References are provided for the convenience of the reader to help distinguish between vulnerabilities. The list is not intended to be complete. | ||
| Assigning CNA | ||
| Qualcomm, Inc. | ||
| Date Record Created | ||
| 20180518 | Disclaimer: The record creation date may reflect when the CVE ID was allocated or reserved, and does not necessarily indicate when this vulnerability was discovered, shared with the affected vendor, publicly disclosed, or updated in CVE. | |
| Phase (Legacy) | ||
| Assigned (20180518) | ||
| Votes (Legacy) | ||
| Comments (Legacy) | ||
| Proposed (Legacy) | ||
| N/A | ||
| This is an record on the CVE List, which provides common identifiers for publicly known cybersecurity vulnerabilities. | ||
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